CP707 Datasheet - Central Semiconductor

CP707 PNP Transistor

www.DataSheet4U.com PROCESS Small Signal Transistor PNP - Darlington Transistor Chip CP707 Central TM Semiconductor Corp. PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 15,440 PRINCIPAL DEVICE TYPES CMPTA63 CMPTA64 CXTA64 CZTA64 MPSA63 MPSA64 EPITAXIAL PLANAR 27 x 27 MILS 9.0 MILS 5.3 x 3.8 MILS 5.3 x 6.5 MILS Al - 30,000Å Au - 18,000Å BACKSIDE COLLECTOR 145 Ad.

CP707_CentralSemiconductor.pdf