KBU602 Datasheet - Comchip Technology

Features

* Diffused Junction Low Forward Voltage Drop High Current Capability High Reliability High Surge Current Capability Ideal for Printed Circuit Boards Mechanical Data Case: Molded Plastic Terminals: Plated Leads Solderable per MIL-STD-202, Method 208 Weight: 1.7 grams (approx.) Mounting Position: Any