DPS128X32BV3, DPS128X32CV3_Dense Datasheet - Dense-Pac Microsystems

DPS128X32BV3, DPS128X32CV3_Dense, 128kx32 High Speed CMOS SRAM

4 Megabit High Speed CMOS SRAM DPS128X32CV3/DPS128X32BV3 .
The DPS128X32CV3/DPS128X32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackab.

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DPS128X32CV3_Dense-PacMicrosystems.pdf

DPS128X32BV3 Datasheet Preview — This datasheet PDF includes multiple part numbers: DPS128X32BV3, DPS128X32CV3_Dense. Please refer to the document for exact specifications by model.

Datasheet Details

Part number:

DPS128X32BV3, DPS128X32CV3_Dense

Manufacturer:

Dense-Pac Microsystems

File Size:

488.67 KB

Description:

128kx32 High Speed CMOS SRAM

Note:

This datasheet PDF includes multiple part numbers: DPS128X32BV3, DPS128X32CV3_Dense.
Please refer to the document for exact specifications by model.

Features

* w
* w
* PIN-OUT DIAGRAM w . D
* Commercial only. PIN NAMES at A0 - A16 I/O0 - I/O31 CE0 - CE3 SEL WE0 - WE1 OE VDD VSS N. C. aS he Address Inputs Data Input/Output Low Chip Enables High Chip Enabl

Applications

* By using SLCCs, the ‘’Versa-Stack’’ family of modules offers a higher board density of memory than available with conventional through-hole, surface mount, module, or hybrid techniques. The DPS128X32BV3 has one active low Chip Enable (CE) and while the DPS128X32CV3 an active low Chip Enable (CE) an

DPS128X32BV3 Distributors

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📌 All Tags

DPS128X32CV3_Dense 128kx32 High Speed CMOS SRAM Dense-Pac Microsystems

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