DPS128X32BV3 - 128kx32 High Speed CMOS SRAM
The DPS128X32CV3/DPS128X32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC) mounted on a co-fired ceramic substrate.
It offers 4 Megabits of SRAM in a package envelope of 1.090 x 1.090 x 0.252
DPS128X32BV3 Features
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* PIN-OUT DIAGRAM w .D
* Commercial only. PIN NAMES at A0 - A16 I/O0 - I/O31 CE0 - CE3 SEL WE0 - WE1 OE VDD VSS N.C. aS he Address Inputs Data Input/Output Low Chip Enables High Chip Enabl
