DPS128X32BV3, DPS128X32CV3_Dense Datasheet - Dense-Pac Microsystems

DPS128X32BV3 128kx32 High Speed CMOS SRAM

The DPS128X32CV3/DPS128X32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC) mounted on a co-fired ceramic substrate. It offers 4 Megabits of SRAM in a package envelope of 1.090 x 1.090 x 0.252 .

DPS128X32BV3 Features

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* PIN-OUT DIAGRAM w .D

* Commercial only. PIN NAMES at A0 - A16 I/O0 - I/O31 CE0 - CE3 SEL WE0 - WE1 OE VDD VSS N.C. aS he Address Inputs Data Input/Output Low Chip Enables High Chip Enabl

DPS128X32CV3_Dense-PacMicrosystems.pdf

DPS128X32BV3 Datasheet Preview — This datasheet PDF includes multiple part numbers: DPS128X32BV3, DPS128X32CV3_Dense. Please refer to the document for exact specifications by model.

Datasheet Details

Part number:

DPS128X32BV3, DPS128X32CV3_Dense

Manufacturer:

Dense-Pac Microsystems

File Size:

488.67 KB

Description:

128kx32 high speed cmos sram.

Note:

This datasheet PDF includes multiple part numbers: DPS128X32BV3, DPS128X32CV3_Dense.
Please refer to the document for exact specifications by model.

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TAGS

DPS128X32BV3 DPS128X32CV3_Dense 128kx32 High Speed CMOS SRAM Dense-Pac Microsystems

DPS128X32BV3 Distributor