DPS128C32BV3, DPS128C32BV3_Dense Datasheet - Dense-Pac Microsystems

DPS128C32BV3 512kx8 High Speed CMOS SRAM

The DPS128C32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC) mounted on a co-fired ceramic substrate. It offers 4 Megabits of SRAM in a package envelope of 1.090 x 1.090 x 0.300 inches. The D.

DPS128C32BV3 Features

* Organizations Available: 128K x 32, 256K x 16, or 512K x 8

* Access Times: 20, 25, 30, 35, 45ns

* Fully Static Operation - No clock or refresh required

* Single +5V Power Supply, ±10% Tolerance

* TTL Compatible

* Common Data Inputs and Outputs

DPS128C32BV3_Dense-PacMicrosystems.pdf

DPS128C32BV3 Datasheet Preview — This datasheet PDF includes multiple part numbers: DPS128C32BV3, DPS128C32BV3_Dense. Please refer to the document for exact specifications by model.

Datasheet Details

Part number:

DPS128C32BV3, DPS128C32BV3_Dense

Manufacturer:

Dense-Pac Microsystems

File Size:

512.94 KB

Description:

512kx8 high speed cmos sram.

Note:

This datasheet PDF includes multiple part numbers: DPS128C32BV3, DPS128C32BV3_Dense.
Please refer to the document for exact specifications by model.

DPS128C32BV3 Distributor

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TAGS

DPS128C32BV3 DPS128C32BV3_Dense 512kx8 High Speed CMOS SRAM Dense-Pac Microsystems