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DPS128X32BV3, DPS128X32CV3_Dense - 128kx32 High Speed CMOS SRAM

DPS128X32BV3 Description

4 Megabit High Speed CMOS SRAM DPS128X32CV3/DPS128X32BV3 .
The DPS128X32CV3/DPS128X32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackab.

DPS128X32BV3 Features

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* PIN-OUT DIAGRAM w . D
* Commercial only. PIN NAMES at A0 - A16 I/O0 - I/O31 CE0 - CE3 SEL WE0 - WE1 OE VDD VSS N. C. aS he Address Inputs Data Input/Output Low Chip Enables High Chip Enabl

DPS128X32BV3 Applications

* By using SLCCs, the ‘’Versa-Stack’’ family of modules offers a higher board density of memory than available with conventional through-hole, surface mount, module, or hybrid techniques. The DPS128X32BV3 has one active low Chip Enable (CE) and while the DPS128X32CV3 an active low Chip Enable (CE) an

📥 Download Datasheet

This datasheet PDF includes multiple part numbers: DPS128X32BV3, DPS128X32CV3_Dense. Please refer to the document for exact specifications by model.
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Datasheet Details

Part number
DPS128X32BV3, DPS128X32CV3_Dense
Manufacturer
Dense-Pac Microsystems
File Size
488.67 KB
Datasheet
DPS128X32CV3_Dense-PacMicrosystems.pdf
Description
128kx32 High Speed CMOS SRAM
Note
This datasheet PDF includes multiple part numbers: DPS128X32BV3, DPS128X32CV3_Dense.
Please refer to the document for exact specifications by model.

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📌 All Tags

128kx32 High Speed CMOS SRAM Dense-Pac Microsystems
Dense-Pac Microsystems DPS128X32BV3-like datasheet