DIP20 - Thermal Data
® Thermal Data DIP 20 20 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W/cm°C leadframe die attach copper epoxy glue ( silver glue ) epoxy resin 0.25 mm 10-40 µm molding compound 3 mm 0.0063W/cm°C Typical assembly configuration before molding : Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time width and die size February 1998 1/2 Thermal Data DIP 20 Rth(j-a) (ºC/W) 120 copper frame thickness = 0.25 mm die pad = 125.
