DIP24 Datasheet - STMicroelectronics

DIP24 Thermal Data

® Thermal Data DIP 24 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W/cm°C leadframe die attach copper epoxy glue ( silver filler ) epoxy resin 0.25 mm 10-40 µm molding compound 3 mm 0.0063W/cm°C Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time width and die size February 1998 1/2 Thermal Data DIP 24 Rth(j-a) (ºC/W) 85 copper frame thickness = 0.25 mm die pad = 150 x 280 sq.mils die size = 10.000 sq.mils 1) 8.

DIP24_STMicroelectronics.pdf