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DIP24 Thermal Data

STMicroelectronics

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Description

® Thermal Data DIP 24 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W/cm°C leadframe die attach .

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Datasheet Specifications

Part number: DIP24
Manufacturer: STMicroelectronics ↗
File Size: 31.53 KB
Datasheet: DIP24_STMicroelectronics.pdf
Description: Thermal Data

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DIP24 Thermal Data STMicroelectronics

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