* For surface mounted applications. Glass passivated junction chip. Built-in strain relief, ideal for automated placement. Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0. Ultra Fast recovery for high efficiency. High temperature soldering : 260 /10 seconds at t
US3JB
FEC Semiconductor
181.90 KB
3.0a surface mount ultra fast recovery rectifier.
F.E.C. Semiconductor
III. Fast / Ultra Fast / Super Fast Recovery Rectifier
3.0A Surface Mount Ultra Fast Recovery Rectifier
US3AB~US3MB
(Package: .
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