NCLD3B1256M32 - 8Gb LPDDR3 SDRAM

Product Overview

Datasheet Details

Part number	NCLD3B1256M32
Manufacturer	FORESEE
File Size	2.49 MB
Description	8Gb LPDDR3 SDRAM
Datasheet	NCLD3B1256M32 Datasheet
Additional preview pages of the NCLD3B1256M32 datasheet.

Product details

Description

SYMBOL CS0_n, CS1_n CK_c, CK_t CKE0, CKE1 CA0 ~ CA9 DQ0 ~ DQ31 DM0 ~ DM3 DQS0_t ~ DQS3_t DQS0_c ~ DQS3_c ZQ VDD1 VDD2 VSS VDDQ VDDCA VSSCA VSSQ VREF ODT 8Gb,16Gb: 178-Ball, LPDDR3 SDRAM DESCRIPTION Chip Select Differential Clocks Clock Enable Command / Address Data I/O Input Data Mask Differential Data Strobe (rising edge) Differential Data Strobe (falling edge) Drive Strength Calibration Core Power Supply Core Power Supply Ground I/O Power Supply CA Power Supply CA Ground I/O Ground Reference

Features

[ FBGA ].
Operation Temperature - (-25)oC ~ 70 oC.
Package - 178-ball FBGA - 12.0x11.5mm2, 1.00t, 0.65mm pitch - Lead & Halogen Free 8Gb,16Gb: 178-Ball, LPDDR3 SDRAM [ LPDDR3 ].
VDD1 = 1.8V (1.7V to 1.95V).
VDD2, VDDCA and VDDQ = 1.2V (1.14V to 1.30).
HSUL_12 interface (High Speed Unterminated Logic 1.2V).
Double data rate architecture for command, address and data Bus; - all control and address except CS_n, CKE latched at both rising and falling edge of the clock.

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Published: Jan 21, 2025 |