Description
Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ201N minimizes both PCB space and RDS(ON).
Features
- = 9 A, 20 V. RDS(ON) = 0.018 Ω=@ VGS = 4.5 V RDS(ON) = 0.030 Ω @ VGS = 2.5 V.
- = Occupies only 5 mm2 of PCB area. Only 55% of the area of SSOT-6.
- = Ultra-thin package: less than 0.70 mm height when mounted to PCB.
- = Outstanding thermal transfer characteristics: 4 times better than SSOT-6.
- = Ultra-low Qg x RDS(ON) figure-of-merit.
- = High power and current handling capability.
FDZ201N_FairchildSemiconductor.pdf
