FDZ202P Datasheet - Fairchild Semiconductor

FDZ202P - P-Channel 2.5V Specified PowerTrenchTM BGA MOSFET

Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ202P minimizes both PCB space and RDS(ON). This BGA MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, hig.

FDZ202P Features

* =

* 5.5 A,

* 20 V. RDS(ON) = 0.045 Ω=@ VGS =

* 4.5 V RDS(ON) = 0.075 Ω @ VGS =

* 2.5 V.

* = Occupies only 5 mm2 of PCB area. Only 55% of the area of SSOT-6

* = Ultra-thin package: less than 0.70 mm height when mounted to PCB

* = Outstanding t

FDZ202P_FairchildSemiconductor.pdf