FDZ206P Datasheet (Fairchild Semiconductor) - P-Channel 2.5V Specified PowerTrench

FDZ206P, P-Channel 2.5V Specified PowerTrench

Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ206P minimizes both PCB space and RDS(ON).

This BGA MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, hig

FDZ206P Features

* 13 A,

* 20 V. RDS(ON) = 9.5 mΩ @ VGS =

* 4.5 V RDS(ON) = 14.5 mΩ @ VGS =

* 2.5 V

* Occupies only 14 mm2 of PCB area. Only 42% of the area of SO-8

* Ultra-thin package: less than 0.80 mm height when mounted to PCB

* 0.65 mm ball pitch