MPXC2012DT1, MPXC2011DT1 Datasheet (Freescale Semiconductor)

MPXC2012DT1, MPXC2011DT1, High Volume Sensor

Chip Pak, 1/3 Gel Chip Pak, No Gel Marking Date Code, Lot ID Date Code, Lot ID Packaging Information Tape and Reel Reel Size 330 mm Tape Width 24 mm Quantity 1000 pc/reel F AA AD PACKAGE DIMENSIONS A M C 1 23 4 N V D1 G FRONT VIEW DETAIL A AC AB BACK VIEW D2 DETAIL A L F B K <

Freescale Semiconductor Technical Data MPXC2011DT1 Rev.

3, 10/2004 High Volume Sensor for Low Pressure Applications Freescale Semiconductor has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub module component or a disposable unit.

The unique concept of the Chip Pak allows great flexibility in system design while allowing an economic solution for the designer.

This new chip carrier package uses Freescale Semiconductor’s unique sensor die with

MPXC2012DT1 Features

* Low Cost

* Integrated Temperature Compensation and Calibration

* Ratiometric to Supply Voltage

* Polysulfone Case Material (Medical, Class V Approved)

* Provided in Easy

* to

* Use Tape and Reel Application Examples

* Respiratory Diagnos