Description
Freescale Semiconductor Technical Data MPXC2011DT1 Rev.3, 10/2004 High Volume Sensor for Low Pressure Applications Freescale Semiconductor has deve.
Chip Pak, 1/3 Gel Chip Pak, No Gel
Marking Date Code, Lot ID Date Code, Lot ID
Packaging Information Tape and Reel
Reel Size 330 mm
Tape Width 24.
Features
* Low Cost
* Integrated Temperature Compensation and Calibration
* Ratiometric to Supply Voltage
* Polysulfone Case Material (Medical, Class V Approved)
* Provided in Easy
* to
Applications
* Freescale Semiconductor has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub
* module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in system design while allowing an economic solution for the designer. T
