MPXC2011DT1 Datasheet (Motorola) - (MPXC2011DT1 / MPXC2012DT1) High Volume Sensor

MPXC2011DT1, (MPXC2011DT1 / MPXC2012DT1) High Volume Sensor

Chip Pak, 1/3 Gel Chip Pak, No Gel Tape Width 24 mm Marking Date Code, Lot ID Date Code, Lot ID Quantity 1000 pc/reel MPXC2011DT1 MPXC2012DT1 Packaging Information Tape and Reel PACKAGE DIMENSIONS A M C L N V K DETAIL A D1 G H FRONT VIEW E END VIEW AC F AA AB NOTES: 8.

DIMENSIONING AND TOLERANCING

www.DataSheet4U.com Freescale Semiconductor Technical Data MPXC2011DT1 Rev.

3, 10/2004 High Volume Sensor for Low Pressure Applications Freescale Semiconductor has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub module component or a disposable unit.

The unique concept of the Chip Pak allows great flexibility in system design while allowing an economic solution for the designer.

This new chip carrier package uses Freescale Semiconductor’s u

MPXC2011DT1 Features

* Low Cost

* Integrated Temperature Compensation and Calibration

* Ratiometric to Supply Voltage

* Polysulfone Case Material (Medical, Class V Approved)

* Provided in Easy

* to

* Use Tape and Reel Application Examples

* Respiratory Diagnos