MPC560xB - (MPC560xB/C) Automotive Body and Gateway Applications

Freescale

MPC560xB Datasheet Preview — Preview of MPC560xB PDF

Datasheet Details

Part number	MPC560xB
Manufacturer	Freescale
File Size	214.44 KB
Description	(MPC560xB/C) Automotive Body and Gateway Applications
Datasheet	MPC560xB_Freescale.pdf

MPC560xB Product details

Description

JDP motherboard (P/N xPC56XXMB) + Mini-module (P/N xPC560BADPT144) (Soldered) Kits include main board, mini-module and P&E wiggler Mini-modules/kits available in socketed (~$450) and soldered (~$350) versions; Final production version will be soldered Mini-module can be used standalone Final production with soldered MCUs planned for Rev A silicon JDP motherboard (P/N xPC56XXMB) + Mini-module (P/N xPC560BADPT100) (Soldered) Ki

Features

required to handle complex control and diagnostic systems. In addition, these scalable devices are supported by an enablement ecosystem that includes software drivers, operating systems and configuration code to help you quickly implement your designs.

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Published: Nov 4, 2008 |