MPC560xC, MPC560xB - (MPC560xB/C) Automotive Body and Gateway Applications

Freescale

MPC560xC Datasheet Preview — This datasheet PDF includes multiple part numbers: MPC560xC, MPC560xB. Please refer to the document for exact specifications by model.

Datasheet Details

Part number	MPC560xC, MPC560xB
Manufacturer	Freescale
File Size	214.44 KB
Description	(MPC560xB/C) Automotive Body and Gateway Applications
Datasheet	MPC560xB_Freescale.pdf
Note	This datasheet PDF includes multiple part numbers: MPC560xC, MPC560xB. Please refer to the document for exact specifications by model.

MPC560xC Product details

Description

JDP motherboard (P/N xPC56XXMB) + Mini-module (P/N xPC560BADPT144) (Soldered) Kits include main board, mini-module and P&E wiggler Mini-modules/kits available in socketed (~$450) and soldered (~$350) versions; Final production version will be soldered Mini-module can be used standalone Final production with soldered MCUs planned for Rev A silicon JDP motherboard (P/N xPC56XXMB) + Mini-module (P/N xPC560BADPT100) (Soldered) Ki

Features

required to handle complex control and diagnostic systems. In addition, these scalable devices are supported by an enablement ecosystem that includes software drivers, operating systems and configuration code to help you quickly implement your designs.

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Published: Nov 4, 2008 |