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MPXC2012DT1, MPXC2011DT1 High Volume Sensor

MPXC2012DT1 Description

Freescale Semiconductor Technical Data MPXC2011DT1 Rev.3, 10/2004 High Volume Sensor for Low Pressure Applications Freescale Semiconductor has deve.
Chip Pak, 1/3 Gel Chip Pak, No Gel Marking Date Code, Lot ID Date Code, Lot ID Packaging Information Tape and Reel Reel Size 330 mm Tape Width 24.

MPXC2012DT1 Features

* Low Cost
* Integrated Temperature Compensation and Calibration
* Ratiometric to Supply Voltage
* Polysulfone Case Material (Medical, Class V Approved)
* Provided in Easy
* to

MPXC2012DT1 Applications

* Freescale Semiconductor has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub
* module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in system design while allowing an economic solution for the designer. T

📥 Download Datasheet

This datasheet PDF includes multiple part numbers: MPXC2012DT1, MPXC2011DT1. Please refer to the document for exact specifications by model.
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Datasheet Details

Part number
MPXC2012DT1, MPXC2011DT1
Manufacturer
Freescale Semiconductor
File Size
84.72 KB
Datasheet
MPXC2011DT1-FreescaleSemiconductor.pdf
Description
High Volume Sensor
Note
This datasheet PDF includes multiple part numbers: MPXC2012DT1, MPXC2011DT1.
Please refer to the document for exact specifications by model.

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📌 All Tags

High Volume Sensor Freescale Semiconductor
Freescale Semiconductor MPXC2012DT1-like datasheet