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GS816273CC 18Mb S/DCD Sync Burst SRAMs

GS816273CC Description

GS816273CC-333/300/250 209-Bump BGA Commercial Temp Industrial Temp 256K x 72 18Mb S/DCD Sync Burst SRAMs 333 MHz *250 MHz 3.3 V or 2.5 V VD.

GS816273CC Features

* Single/Dual Cycle Deselect selectable
* IEEE 1149.1 JTAG-compatible Boundary Scan
* ZQ mode pin for user-selectable high/low output drive
* 3.3 V or 2.5 V core power supply
* 3.3 V or 2.5 V I/O supply
* LBO pin for Linear or Interleaved Burst mode

GS816273CC Applications

* JEDEC-standard 209-bump BGA package
* RoHS-compliant 209-bump BGA package available with the Linear Burst Order (LBO) input. The Burst function need not be used. New addresses can be loaded on every cycle with no degradation of chip performance. SCD and DCD Pipelined Reads The GS8

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Datasheet Details

Part number
GS816273CC
Manufacturer
GSI Technology
File Size
517.76 KB
Datasheet
GS816273CC-GSITechnology.pdf
Description
18Mb S/DCD Sync Burst SRAMs

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18Mb DCD Sync Burst SRAMs GSI Technology
GSI Technology GS816273CC-like datasheet