GS816273CC 18Mb S/DCD Sync Burst SRAMs

GSI Technology

Description

GS816273CC-333/300/250 209-Bump BGA Commercial Temp Industrial Temp 256K x 72 18Mb S/DCD Sync Burst SRAMs 333 MHz *250 MHz 3.3 V or 2.5 V VD.

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Datasheet Specifications

Part number: GS816273CC
Manufacturer: GSI Technology
File Size: 517.76 KB
Datasheet: GS816273CC-GSITechnology.pdf
Description: 18Mb S/DCD Sync Burst SRAMs

Features

* Single/Dual Cycle Deselect selectable
* IEEE 1149.1 JTAG-compatible Boundary Scan
* ZQ mode pin for user-selectable high/low output drive
* 3.3 V or 2.5 V core power supply
* 3.3 V or 2.5 V I/O supply
* LBO pin for Linear or Interleaved Burst mode

Applications

* JEDEC-standard 209-bump BGA package
* RoHS-compliant 209-bump BGA package available with the Linear Burst Order (LBO) input. The Burst function need not be used. New addresses can be loaded on every cycle with no degradation of chip performance. SCD and DCD Pipelined Reads The GS8

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GS816273CC 18Mb DCD Sync Burst SRAMs GSI Technology

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