* WLAN - Complies with IEEE802.11 b/g/n 1T1R standard for 2.4GHz band, supports 20MHz and 40MHz bandwidth transmission, Short Guard Interval (400ns) - Supports 802.11e QoS Enhancement (WMM), 802.11h TPC, Spectrum Measurement and 802.11i (WPA, WPA2) - Frame aggregation for increased MAC efficienc
C704T0
GemiCom
291.47 KB
Ieee 802.11bgn 1t1r & bt4.0 combo usb lga module.
C704T0 WiFi+BT 1T1R Combo LGA Module
Page 1 of 10
Product Specification
C704T0
IEEE 802.11BGN 1T1R & BT4.0 Combo USB LGA Module
Version: 0.4
Jan. 1.
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C704S0 WiFi+BT 1T1R Combo LGA Module
Page 1 of 10
Product Specification
C704S0
IEEE 802.11BGN 1T1R & BT4.0 Combo SDIO LGA Module
Version: 0.4
Sep. .
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WON-TOP ELECTRONICS
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Diffused Junction Low Leakage Low Cost High Surge Current Capability Die Size 220 mil HEX
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Diffused Junction Low Leakage Low Cost High Surge Current Capability Die Size 220 mil HEX
C7020, C7024, C703.
C7027 - C7027 / C7035 Series
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C7027 a C7035 Série
UV polovodičová čidla plamene
KATALOGOVÝ LIST
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Čidla plamene C7027A, C7035A se používají ve spojení se zesilovači R7249A.
C7027A1023 - C7027 / C7035 Series
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UV polovodičová čidla plamene
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Čidla plamene C7027A, C7035A se používají ve spojení se zesilovači R7249A.
C7035 - C7027 / C7035 Series
(Honeywell)
C7027 a C7035 Série
UV polovodičová čidla plamene
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Čidla plamene C7027A, C7035A se používají ve spojení se zesilovači R7249A.
C7036 - 70A AVALANCHE AUTOMOTIVE CELL DIODE
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Diffused Junction Low Leakage Low Cost High Surge Current Capability Die Size 220 mil HEX
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C70710M0065222 - SIM Reader
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Amphenol
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1. Material: Pin: Copper alloy Insulator: High temperature thermoplastic 2. Plating: Contact area: 0.8 µm Au at mating area Sold.
