FBM1206 Datasheet - HITANO

FBM1206 Multilayer Chip Bead

Page HITANO ENTERPRISE CORP. 7F-7, No. 3, Wu Chuan 1st Road, New Taipei Industrial Park, New Taipei City, TAIWAN, R.O.C. Tel: +886 2 2299 1331 (Rep.) Fax: +886 2 2298 2466, 2298 2969 Prepared by 30-Sep.-2014 Andy Hsu Checked by 30-Sep.-2014 Hwa Wu Approved by 30-Sep.-2014 Hwa Wu Accepted by (c.

FBM1206 Features

* Excellent solderability and high heat resistance for either flow or reflow soldering.

* A closed circuit formed by internal silver printed layer, acting like a magn

FBM1206 Datasheet (219.74 KB)