FBM1808 Datasheet - HITANO

Multilayer Chip Bead

FBM1808 Features

* Excellent solderability and high heat resistance for either flow or reflow soldering.

* A closed circuit formed by internal silver printed layer, acting like a magn

FBM1808 General Description

Page HITANO ENTERPRISE CORP. 7F-7, No. 3, Wu Chuan 1st Road, New Taipei Industrial Park, New Taipei City, TAIWAN, R.O.C. Tel: +886 2 2299 1331 (Rep.) Fax: +886 2 2298 2466, 2298 2969 Prepared by 30-Sep.-2014 Andy Hsu Checked by 30-Sep.-2014 Hwa Wu Approved by 30-Sep.-2014 Hwa Wu Accepted by (c.

FBM1808 Datasheet (219.74 KB)

FBM1808 Datasheet Preview — Preview of FBM1808 PDF

Datasheet Details

Part number:

FBM1808

Manufacturer:

HITANO

File Size:

219.74 KB

Description:

Multilayer chip bead.
Data Sheet Customer: Product: Multilayer Chip Bead FBM Series Size : 0402/0603/0805/1204/1206/1210/1808/1812 Issued Date: 30-September-20.

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FBM1808 Multilayer Chip Bead HITANO

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FBM1808 Features

FBM1808 General Description

Datasheet Details

File Size:

Description:

FBM1808 Distributor