H9TP32A4GDBCPR Datasheet - Hynix Semiconductor

H9TP32A4GDBCPR 4GB eNAND (x8) / LPDDR2-S4B 4Gb(x32)

and is subject to change without notice. SK hynix does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev 0.3 / Jan. 2013 1 Preliminary H9TP32A4GDBCPR 4GB eNAND (x8) / LPDDR2-S4B 4Gb(x32) Document Title CI-MCP 4GB eNAND(x8) Flash / 4Gb (x32) LPDDR2-S.

H9TP32A4GDBCPR Features

* [ CI-MCP ]

* Operation Temperature - (-25)oC ~ 85oC

* Package - 162-ball FBGA - 11.5x13.0mm2, 1.0t, 0.5mm pitch - Lead & Halogen Free [ e-NAND ] [ LPDDR2 S4B ]

* Packaged NAND flash memory with MultiMediaCard interface

* e-NAND system specification, compliant with V4.41

* Ful

H9TP32A4GDBCPR-HynixSemiconductor.pdf