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DF100R07W1H5FP_B53 IGBT

DF100R07W1H5FP_B53 Description

DF100R07W1H5FP_B53 EasyPACK™ Modul mit TRENCHSTOP™ 5 H5 und CoolSiC™ Diode und PressFIT / bereits aufgetragenem Thermal Interface Material EasyPACK™ m.

DF100R07W1H5FP_B53 Features

* CoolSiC (TM) Schottky diode gen 5
* Increased blocking voltage capability up to 650V
* Low inductive design
* Low switching losses Mechanical Features
* Al2O3 substrate with low thermal resistance
* Integrated NTC temperature sensor
* PressFI

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