DF100R07W1H5FP_B54 Datasheet - Infineon

DF100R07W1H5FP_B54 IGBT

DF100R07W1H5FP_B54 EasyPACK™ Modul mit TRENCHSTOP™ 5 H5 und CoolSiC™ Diode und PressFIT / bereits aufgetragenem Thermal Interface Material EasyPACK™ module with TRENCHSTOP™ 5 H5 and CoolSiC™ diode and PressFIT / pre-applied Thermal Interface Material J Typische Anwendungen Solar Anwendungen Elektrische Eigenschaften CoolSiC (TM) Schottky Diode Gen 5 Erhöhte Sperrspannungsfestigkeit auf 650V Niederinduktives Design Niedrige Schaltverluste Mechan.

DF100R07W1H5FP_B54 Features

* CoolSiC (TM) Schottky diode gen 5

* Increased blocking voltage capability up to 650V

* Low inductive design

* Low switching losses Mechanical Features

* Al2O3 substrate with low thermal resistance

* Integrated NTC temperature sensor

* Solder

DF100R07W1H5FP_B54 Datasheet (699.58 KB)