Description
IGC28T65T8M IGBT3 Chip Medium Power .
AQL 0,65 for visual inspection according to failure catalogue Electrostatic Discharge Sensitive Device according to MIL-STD 883
Revision History Vers.
Features
* 650V Trench & Field Stop technology
* high short circuit capability, self limiting
short circuit current
* positive temperature coefficient
* easy paralleling
Applications
* Recommended for:
* power modules
Applications:
* drives
Chip Type IGC28T65T8M
VCE 650V
ICn 50A
Die Size 6.57 x 4.2 mm2
C
G E
Package sawn on foil
Mechanical Parameters Die size Emitter pad size (incl. gate pad) Gate pad size Area total Thickness Wafer size Max. possible chips per wafer