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IPC045N25N3 - MOSFET

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IPC045N25N3 Product details

Description

N-channel enhancement mode For dynamic characterization refer to the datasheet of BSZ16DN25NS3 G AQL 0.65 for visual inspection according to failure catalogue Electrostatic Discharge Sensitive Device according to JEDEC Die bond: soldered or glued Backside metallization: NiV system Frontside metallization: AlSi system Passivation: nitride (only on edge structure) Power MOS Transistor Chip Table 1 Key Performance

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