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IPC302N20N3 - MOSFET

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IPC302N20N3 Product details

Description

N-channel enhancement mode For additional characteristic and max ratings refer to the datasheet of IPP110N20N3 G AQL 0.65 for visual inspection according to failure catalogue Electrostatic Discharge Sensitive Device according to MIL-STD 883C Die bond: soldered or glued Backside metallization: NiV system Frontside metallization: AlCu system Passivation: nitride (only on edge structure) Power MOS Transistor Chip Tabl

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