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SIGC101T170R3E Datasheet, Igbt, Infineon

Igbt

Image	Manufacturer	Part Number	B2B mpn	Description	Distributor	In Stock	Quantity	Price	Buy Now
	Infineon Technologies AG	SIGC101T170R3E	SIGC101T170R3EX1SA2	- Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC101T170R3EX1SA2)	Avnet Americas	0	24000 units	$12.79	🛒 Buy Now

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SIGC101T170R3E

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Description:

Igbt.
AQL 0,65 for visual inspection according to failure catalogue Electrostatic Discharge Sensitive Device according to MIL-.

✔ SIGC101T170R3E Features

1700V Trench & Field Stop technology
low turn-off losses
short tail current
positive temperature coefficient
easy paralleling This chip is used for:
power m

✔ SIGC101T170R3E Application

drives Chip Type VCE IC Die Size SIGC101T170R3E 1700V 75A 10.03 x 10.03 mm2 C G E Package sawn on f

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TAGS

SIGC101T170R3E IGBT Infineon

SIGC101T170R3E Distributor

Infineon Technologies AG

SIGC101T170R3EX1SA2

(Alt: SP000906252)

EBV Elektronik

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Qty : 24000 units

Unit Price : $0

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