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SIGC42T170R3GE IGBT

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Description

SIGC42T170R3GE IGBT3 Power Chip .
AQL 0,65 for visual inspection according to failure catalogue Electrostatic Discharge Sensitive Device according to MIL-STD 883 Test-Normen Villach/Pr.

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Features

* 1700V Trench + Field Stop technology
* low turn-off losses
* short tail current
* positive temperature coefficient
* easy paralleling This chip is used for:

Applications

* drives C G E Chip Type VCE ICn SIGC42T170R3GE 1700V 29A Die Size 6.5 x 6.46 mm2 Package sawn on foil MECHANICAL PARAMETER Raster size Emitter pad size (incl. gate pad) Gate pad size Area total / active Thickness Wafer size Max. possible chips per wafer Passivation frontside Pad metal B

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