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MD5811-D256-V3Q18

Mobile Diskonchip P3

MD5811-D256-V3Q18 Features

* High capacity: 256Mbit (32MByte) Device cascading option: up to 1Gbit (128MByte) Enhanced Programmable Boot Block enabling eXecute In Place (XIP) functionality using 16-bit interface Small form factors: 48-pin TSOP-I package 85-ball FBGA 7x10x1.2 mm package Enhanced performance with: Multi-plane op

MD5811-D256-V3Q18 General Description

6 Standard Interface 7 2.2.1 2.2.2 2.2.3 Pin/Ball Diagrams 7 System Interface 9 Signal Description 10 Pin/Ball Diagram 14 System Interface 16 Signal Description 17 2.3 Multiplexed Interface 14 2.3.1 2.3.2 2.3.3 3. Theory of Operation 21 3.1 3.2 Overview 21 System Interface 22 3.2.1 3.2.2 .

MD5811-D256-V3Q18 Datasheet (788.05 KB)

Preview of MD5811-D256-V3Q18 PDF

Datasheet Details

Part number:

MD5811-D256-V3Q18

Manufacturer:

M-Systems

File Size:

788.05 KB

Description:

Mobile diskonchip p3.
www.datasheet4u.com Mobile DiskOnChip P3 256Mb Flash Disk with M-Systems’ x2 Technology Preliminary Data Sheet, June 2003 Highlights Mobile DiskOnC.

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TAGS

MD5811-D256-V3Q18 Mobile Diskonchip M-Systems

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