MD5811-D256-V3Q18 Datasheet - M-Systems

MD5811-D256-V3Q18 Mobile Diskonchip P3

6 Standard Interface 7 2.2.1 2.2.2 2.2.3 Pin/Ball Diagrams 7 System Interface 9 Signal Description 10 Pin/Ball Diagram 14 System Interface 16 Signal Description 17 2.3 Multiplexed Interface 14 2.3.1 2.3.2 2.3.3 3. Theory of Operation 21 3.1 3.2 Overview 21 System Interface 22 3.2.1 3.2.2 .

www.datasheet4u.com Mobile DiskOnChip P3 256Mb Flash Disk with M-Systems’ x2 Technology Preliminary Data Sheet, June 2003 Highlights Mobile DiskOnChip™ P3, a member of M-Systems’ DiskOnChip™ family of optimized memory solutions for new-generation mobile handsets, provides high performance and reliability using NAND flash technology. It combines Toshiba’s cutting-edge 0.13 micron NAND flash manufacturing process enhanced for performance and reliability with M-Systems’ x2 technology. Mobile Dis.

MD5811-D256-V3Q18 Features

* High capacity: 256Mbit (32MByte) Device cascading option: up to 1Gbit (128MByte) Enhanced Programmable Boot Block enabling eXecute In Place (XIP) functionality using 16-bit interface Small form factors: 48-pin TSOP-I package 85-ball FBGA 7x10x1.2 mm package Enhanced performance with: Multi-plane op

MD5811-D256-V3Q18 Datasheet (788.05 KB)