MD5811-D256-xxxx, MD5811-D256-V3Q18_M Datasheet (M-Systems)

MD5811-D256-xxxx, MD5811-D256-V3Q18_M, Mobile Diskonchip P3

6 Standard Interface 7 2.2.1 2.2.2 2.2.3 Pin/Ball Diagrams 7 System Interface 9 Signal Description 10 Pin/Ball Diagram 14 System Interface 16 Signal Description 17 2.3 Multiplexed Interface 14 2.3.1 2.3.2 2.3.3 3.

Theory of Operation 21 3.1 3.2 Overview 21 System Interface 22 3.2.1 3.2.2

www.datasheet4u.com Mobile DiskOnChip P3 256Mb Flash Disk with M-Systems’ x2 Technology Preliminary Data Sheet, June 2003 Highlights Mobile DiskOnChip™ P3, a member of M-Systems’ DiskOnChip™ family of optimized memory solutions for new-generation mobile handsets, provides high performance and reliability using NAND flash technology.

It combines Toshiba’s cutting-edge 0.13 micron NAND flash manufacturing process enhanced for performance and reliability with M-Systems’ x2 technology.

Mobile Dis

MD5811-D256-xxxx Features

* High capacity: 256Mbit (32MByte) Device cascading option: up to 1Gbit (128MByte) Enhanced Programmable Boot Block enabling eXecute In Place (XIP) functionality using 16-bit interface Small form factors: 48-pin TSOP-I package 85-ball FBGA 7x10x1.2 mm package Enhanced performance with: Multi-plane op