Description
MADP-042XX5-13060 Series SURMOUNTTM PIN Diodes: RoHS Rev.V6 .
This device is a silicon, glass PIN diode surmount chip fabricated with M/A-COM Tech’s patented HMICTM process.
Features
* Surface Mount
* No Wirebonds Required
* Rugged Silicon-Glass Construction
* Silicon Nitride Passivation
* Polymer Scratch Protection
* Low Parasitic Capacitance and Inductance
* High Average and Peak Power Handling
Applications
* These packageless devices are suitable for moderate incident power applications, ≤ 10W/C. W. or where the peak power is ≤ 50W, pulse width is ≤ 1μS, and duty cycle
is ≤ 0.01%. Their low parasitic inductance, 0.4 nH, and
excellent RC constant, make these devices a superior
choice for higher frequency
