MADP-042905-13060 Datasheet, Diodes, MA-COM

MADP-042905-13060 Features

• Diodes
•  Surface Mount
•  No Wirebonds Required
•  Rugged Silicon-Glass Construction
•  Silicon Nitride Passivation
•  Polymer Scratch Protection

PDF File Details

Part number:

MADP-042905-13060

Manufacturer:

MA-COM

File Size:

127.78kb

Download:

📄 Datasheet

Description:

Pin diodes. This device is a silicon, glass PIN diode surmount chip fabricated with M/A-COM Tech’s patented HMICTM process. This device features

MADP-042905-13060 Application

• Applications These packageless devices are suitable for moderate incident power applications, ≤ 10W/C.W. or where the peak power is ≤ 50W, pulse wid

TAGS

MADP-042905-13060

MA-COM

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