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DS34S108, DS34S101 (DS34S101 - DS34S108) Single/Dual/Quad/Octal TDM-over-Packet Chip

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Description

ABRIDGED DATA SHEET www.DataSheet4U.com Rev: 101708 DS34S101, DS34S102, DS34S104, DS34S108 Single/Dual/Quad/Octal TDM-over-Packet Chip General Descr.
These IETF PWE3 SAToP/CESoPSN/TDMoIP/HDLC compliant devices allow up to eight E1, T1 or serial streams or one high-speed E3, T3, STS-1 or serial strea.

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This datasheet PDF includes multiple part numbers: DS34S108, DS34S101. Please refer to the document for exact specifications by model.
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Datasheet Specifications

Part number
DS34S108, DS34S101
Manufacturer
Maxim Integrated ↗ Products
File Size
1.38 MB
Datasheet
DS34S101_MaximIntegratedProducts.pdf
Description
(DS34S101 - DS34S108) Single/Dual/Quad/Octal TDM-over-Packet Chip
Note
This datasheet PDF includes multiple part numbers: DS34S108, DS34S101.
Please refer to the document for exact specifications by model.

Features

* Transport of E1, T1, E3, T3 or STS-1 TDM or CBR Serial Signals Over Packet Networks Full Support for These Mapping Methods: SAToP, CESoPSN, TDMoIP (AAL1), HDLC, Unstructured, Structured, Structured with CAS Adaptive Clock Recovery, Common Clock, External Clock and Loopback Timing Modes On-Chip TDM C

Applications

* TDM Circuit Extension Over PSN o Leased-Line Services Over PSN o TDM Over GPON/EPON o TDM Over Cable o TDM Over Wireless Cellular Backhaul Over PSN Multiservice Over Unified PSN HDLC-Based Traffic Transport Over PSN
* See detailed

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