AN830 RFID Tag and COB Development Guide with Microchip’s RFID Devices Author: Youbok Lee, Ph.D.
Microchip Technology Inc.
Since the direct die att achment reduces a step for making the COB package, it is widely used for low cost and high volume applications such as smart labels.
The direct die att achment can be achieved with two dif ferent methods: (a) wire bonding or (b) flip-chip with bumped die.
For the flip-chip, it needs a special bumping on the die’s bond pads.
Typically the bump materia
