AN830 Datasheet - Microchip

AN830, RFID Tag and COB Development Guide

AN830 RFID Tag and COB Development Guide with Microchip’s RFID Devices Author: Youbok Lee, Ph.D.Microchip Technology Inc.Since the direct die att ac.

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Datasheet Details

Part number:

AN830

Manufacturer:

Microchip ↗

File Size:

2.83 MB

Description:

RFID Tag and COB Development Guide

Applications

* such as smart labels. The direct die att achment can be achieved with two dif ferent methods: (a) wire bonding or (b) flip-chip with bumped die. For the flip-chip, it needs a special bumping on the die’s bond pads. Typically the bump material is made of gold with approximately 25 um of height. The f

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