GC1304 Datasheet - Microsemi Corporation

GC1304, ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES

KV1913A thru GC1310 MICROWAVE PRODUCTS DIVISION ENHANCED PERFORMANCE SURFACE MOUNT "EPSM" PACKAGED DEVICES PRODUCT PREVIEW .
KEY FEATURES !" Frequencies from VHF to 6 GHz !" Lower Parasitics !" Mil Grade Ceramic/Epoxy Amalgam Construction !" Dense SiO2 Junction Passivation.

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GC1304_MicrosemiCorporation.pdf

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Datasheet Details

Part number:

GC1304

Manufacturer:

Microsemi ↗ Corporation

File Size:

290.20 KB

Description:

ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES

Features

* !" Frequencies from VHF to 6 GHz !" Lower Parasitics !" Mil Grade Ceramic/Epoxy Amalgam Construction !" Dense SiO2 Junction Passivation !" Superior Consistency/Repeatability !" Footprints Available for SOT-23/SOD-323/SOD-123 !" Priced for Commercial Products !" Tape & Reel for Volume Pick & Place AP

Applications

* BENEFITS APPLICATIONS/BENEFIT S !" High performance wireless surface mounting including: !" GSM !" TAGS !" WANS !" PCS !" AMPS !" DECT !" CELLULAR W W W . Microsemi . COM Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistency of p

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GC1304 ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES Microsemi Corporation

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