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MM196 6 MOSFET Multi-Chip Module

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Description

MM196 6 MOSFET Multi-Chip Module SANTA ANA DIVISION PRELIMINARY SPECIFICATION .
KEY FEATURES !" Miniature size, Multi-Chip !" Convenient mounting, Ball Grid Array, BGA Module, MCM W W W .

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Features

* !" Miniature size, Multi-Chip !" Convenient mounting, Ball Grid Array, BGA Module, MCM W W W . Microsemi . COM The MM196 is a Multi-Chip Module, MCM, incorporating 6 independent MOSFET die into a convenient BGA package. This device is also available as discrete individual packaged Powermite3, see

Applications

* BENEFITS APPLICATIONS/BENEFITS !" Three phase switching !" AC-DC converters !" Applications utilizing multiple MOSFET die in multiple or array configurations IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www. microsemi. com INDIVIDUAL COMPONENT SPECIFICATIONS Components M

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