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MXP22-C Datasheet - Microsemi

MXP22-C Monolithic Photodiode Array-Chip

MXP22-C Features

* Dielectrically Isolated Diodes Aluminum Wire bondable Backside Metallization - Gold Die Attach methods: Eutectic or Epoxy o Electrical Characteristic s @ 25 SYMBOL VOC ISC VB C CONDITIONS 10 mW/cm2, wavelength = 850 nm 10 mW/cm2, wavelength = 850 nm IR = 10

MXP22-C Datasheet (38.87 KB)

Preview of MXP22-C PDF

Datasheet Details

Part number:

MXP22-C

Manufacturer:

Microsemi ↗

File Size:

38.87 KB

Description:

Monolithic photodiode array-chip.

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TAGS

MXP22-C Monolithic Photodiode Array-Chip Microsemi

MXP22-C Distributor