This line of ‘MELF’ high power PIN diodes are hermetically sealed surface mount packaged devices with full face bonded chips for low inductance construction.
The MELF ceramic package has square end terminations which are ideal for surface mount and pick and place operations.
The PIN diode chips are
SM1003 Features
* Non-Magnetic1 Versions Ideal for MRI Applications
* Very Low Inductance, Full Face Bonding
* Hi-Rel Hermetic Design
* Surface Mount Devices Available in Tape and Reel
* RoHS Compliant2 Versions Available www.MICROSEMI.com APPLICATIONS The MELF diodes are used as switching, at
Datasheet Details
SM1003, SM1002
177.18 KB
Melf pin diodes.
This datasheet PDF includes multiple part numbers: SM1003, SM1002.
Please refer to the document for exact specifications by model.
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