SM1003 Description
This line of ‘MELF’ high power PIN diodes are hermetically sealed surface mount packaged devices with full face bonded chips for low inductance construction. The MELF ceramic package has square end terminations which are ideal for surface mount and pick and place operations. The PIN diode chips are coated with a special hard glass passivation which is required for high power applications and to enhance the...
SM1003 Key Features
- Non-Magnetic1 Versions Ideal for MRI