Description
I/O0-31 A0-16 WE1-4# CS1-4# OE# VCC GND NC
Data Inputs/Outputs Address Inputs Write Enables Chip Selects Output Enable Power Supply Ground Not Connected
OE# A0-16
Block Diagram
WE#1 CS#1
WE#2 CS#2
WE#3 CS#3
128K x 8
128K x 8
128K x 8
WE#4 CS#4 128K x 8
8 I/O 0-7
8 I/O 8-15
8 I/O 16-23
8 I/O 24-31
Microsemi Corporation reserves the right to change products or specifications without notice.September 2010 © 2010 Microsemi Corporation.All rights reserved.1
Rev.18
Microsemi Cor
Features
- Access Times of 15, 17, 20, 25, 35, 45, 55ns.
- MIL-STD-883 Compliant Devices Available.
- Packaging.
- 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP (Package 400).
- 68 lead, 40mm CQFP (G4T)1, 3.56mm (0.140") (Package 502).
- 68 lead, 22.4mm CQFP (G2U), 3.56mm (0.140"), (Package 510).
- 68 lead, 22.4mm (0.880") square, CQFP (G2L), 5.08mm (0.200") high, (Package 528).
- Organized as 128Kx32; User Configurable as 256Kx16 or 512Kx8.
- Comme.