Datasheet Details
- Part number
- MMBT2907LT1
- Manufacturer
- Motorola
- File Size
- 247.42 KB
- Datasheet
- MMBT2907LT1_MotorolaInc.pdf
- Description
- General Purpose Transistors
MMBT2907LT1 Description
MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MMBT2907LT1/D General Purpose Transistors PNP Silicon 1 BASE COLLECTOR 3 MMBT2907LT1.
MMBT2907LT1 Features
* ould always be observed in order to minimize the thermal stress to which the devices are subjected.
* Always preheat the device.
* The delta temperature between the preheat and soldering should be 100°C or less.
* When preheating and soldering, the temperature of the lea
MMBT2907LT1 Applications
* Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a
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