NF2W757DRT-V1M3 - LED
Package Materials Encapsulating Resin Materials Electrodes Materials Weight Heat-Resistant Polymer (+) Silicone Resin (with diffuser and phosphor) + Ag-plated Copper Alloy 0.018g(TYP) * 。 Dimensions do not include mold flash.
KA Protection Device 4 SOLDERING NICHIA STS-DA1-3089B
NICHIA STS-DA1-3089B