* 2
* stage module solution that includes an LDMOS integrated circuit as a driver and a GaN final stage amplifier
* Advanced high performance in
* package Doherty
* Thermal path is separated from electrical/solder connection path for
enhanced thermal dissipation
Applications
* that demand high performance in the smallest footprint. Ideal for applications in massive MIMO systems, outdoor small cells and low power remote radio heads. The field
* proven LDMOS and GaN on SiC power amplifiers are designed for TDD LTE and 5G systems. 3300
* 3670 MHz
* Typic