BYG50 Controlled avalanche rectifiers

NXP

Description

DISCRETE SEMICONDUCTORS DATA SHEET ok, halfpage M3D168 BYG50 series Controlled avalanche rectifiers Preliminary speciﬁcation 1996 May 24 Philips S.
DO-214AC; SOD106 surface mountable package with glass passivated chip.

📥 Download Datasheet

BYG50 Datasheet Preview — Preview of BYG50 PDF

Datasheet Specifications

Part number: BYG50
Manufacturer: NXP ↗
File Size: 41.11 KB
Datasheet: BYG50_PhilipsSemiconductors.pdf
Description: Controlled avalanche rectifiers

Features

* Glass passivated
* High maximum operating temperature
* Low leakage current
* Excellent stability
* Guaranteed avalanche energy absorption capability
* UL 94V-O classified plastic package
* Shipped in 12 mm embossed tape. Top view Side view h

Applications

* These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to ful

BYG50 Distributors

📁 Related Datasheet

BYG10D BYG10G BYG10J BYG10K BYG10M BYG10Y

📌 All Tags

BYG50 Controlled avalanche rectifiers NXP

NXP BYG50-like datasheet