BYG50D Controlled avalanche rectifiers

NXP

Description

DISCRETE SEMICONDUCTORS DATA SHEET ok, halfpage M3D168 BYG50 series Controlled avalanche rectifiers Preliminary speciﬁcation 1996 May 24 Philips S.
DO-214AC; SOD106 surface mountable package with glass passivated chip.

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Datasheet Specifications

Part number: BYG50D
Manufacturer: NXP ↗
File Size: 41.11 KB
Datasheet: BYG50D_PhilipsSemiconductors.pdf
Description: Controlled avalanche rectifiers

Features

* Glass passivated
* High maximum operating temperature
* Low leakage current
* Excellent stability
* Guaranteed avalanche energy absorption capability
* UL 94V-O classified plastic package
* Shipped in 12 mm embossed tape. Top view Side view h

Applications

* These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to ful

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BYG50D Controlled avalanche rectifiers NXP

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