BYG26 Datasheet - NXP

BYG26 SMA ultra fast soft-recovery controlled avalanche rectifiers

DO-214AC surface mountable package with glass passivated chip. The well-defined void-free case is of a transfer-moulded thermo-setting plastic. The small rectangular package has two J bent leads. cathode band k a Side view MSA474 Fig.1 Simplified outline (DO-214AC) and symbol. LIMITING VALUES I.

BYG26 Features

* Glass passivated

* High maximum operating temperature

* Ideal for surface mount automotive applications

* Low leakage current

* Excellent stability

* Guaranteed avalanche energy absorption capability

* UL 94V-O classified plastic package

BYG26_PhilipsSemiconductors.pdf