* r wave) soldering technique should be used.
* The longitudinal axis of the package footprint must be parallel to the solder flow.
* The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a dro
PCF1303T
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18-element bar graph lcd driver.
INTEGRATED CIRCUITS DATA SHEET PCF1303T 18-element bar graph LCD driver Product speciļ¬cation File under Integrated Circuits, IC01 November 1986 Phi.
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