SOT527-1 Datasheet (NXP) - Package outline

SOT527-1, Package outline

PDF: 2003 Apr 07 Philips Semiconductors Package outline HTSSOP20: plastic thermal enhanced thin shrink small outline package; 20 leads; body width 4.4 mm; exposed die pad SOT527-1 D E A X c y exposed die pad side HE v M A Z Dh 20 11 pin 1 index Eh A2 A1 (A 3) A θ Lp L 1 e bp 10 w M detail X 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max.

1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.20 0.09 D(1) 6.6 6.4 Dh 4.3 4.1 E(2) 4.5 4.3 Eh 3.1