SOT545-3 Datasheet (NXP) - plastic thermal enganced thin quad flat package

SOT545-3, plastic thermal enganced thin quad flat package

( DataSheet : www.DataSheet4U.com ) PDF: 2004 Feb 05 Philips Semiconductors Package outline HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad SOT545-3 c y exposed die pad side X Dh 36 37 25 24 ZE A e Eh w M θ bp pin 1 index 48 1 w M 12 ZD v M A 13 detail X Lp L E HE A A2 A1 (A 3) bp e D HD B v M B 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) A UNIT max.

mm 1.2 A1 0.15 0.05 A2 1.05 0.95 A3 0.25 bp 0.27 0.17 c 0.20