NXH25C120L2C2SG Datasheet - ON Semiconductor

NXH25C120L2C2SG TMPIM 25A CIB Module

NXH25C120L2C2SG Features

* Low Thermal Resistance

* 6 mm Clearance Distance between Pin to Heatsink

* Compact 73 mm × 40 mm × 8 mm Package

* Solderable Pins

* Thermistor

* These Devices are Pb

* Free, Halogen Free/BFR Free and are RoHS Compliant Typical Applications

Datasheet Details

NXH25C120L2C2SG

372.79 KB

Tmpim 25a cib module.

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